Principal Engineer - Packaging Engineering

  • China Office - Shanghai, Shanghai, China, 000001

Dedicated to making data faster and safer, Rambus creates innovative hardware, software and services that drive technology advancements from the data center to the mobile edge. Our architecture licenses, IP cores, chips, software, and services span memory and interfaces, security and emerging technologies to positively impact the modern world. 

 

Our customers are leading chip and system design firms, foundries, and service providers. Our products are integrated into tens of billions of devices and systems. They power and secure diverse applications in a growing number of target segments including data center, networking, AI, automotive and IOT.

 

Rambus is seeking to hire exceptional talent to join some of the brightest inventors and engineers in the world to develop products that have real life impact. 

 

Rambus is looking for an experienced IC package design engineer in the Systems Engineering team of IP Cores BU. The suitable candidate will be involved through the design and development phase of both high-speed complex SerDes and Memory IP PHY development as well as semiconductor product chips. You will work closely with die floor-planning and physical design teams to complete package/interposer route feasibility studies for the targeted applications considering the form-factor, cost and performance. You will be responsible for developing the die level bump-out and the package level pin-out and the overall package design, development and manufacturing. You will also be responsible for the analyzing this database and ensuring that it meets the electrical signal and power integrity requirements. You will document the design and release package design guideline.

Responsibilities

  • Complete package/interposer design feasibility studies and provide feedback for IC and PCB design teams.
  • Recommend package layer stack-up, material, impedance targets and net assignments for signals
  • Complete package designs and parasitic extractions for Rambus products
  • Optimize single-ended/differential insertion loss, return loss, cross-talk for high speed buses
  • IR Drop and PDN optimization in packages/interposers. Recommend caps on packages
  • Complete system level PDN analysis and recommend decoupling strategies
  • Optimize and implement routing for high-speed signals and power planes
  • Document package design customer integration guides
  • Design BGA packages for high frequency ICs using Allegro Package Designer using SIP Layout
  • Model BGA packaging in 3D and perform tradeoff studies
  • Develop package designs for signals exceeding 100Ghz GHz using RF transmission lines
  • Complete package extractions (signal and power) using standard industry tools
  • Complete system level PDN analysis using Keysight ADS, HSPICE
  • Complete transient channel simulation using Keysight ADS, HSPICE

Qualifications

  • Strong background in Electromagnetics and Transmission Line principles
  • Experience with IC package/interposer design tools such as Cadence APD or SiP
  • Strong interpersonal, written and verbal skills to work with vendors, internal and external customers
  • Proficient in 2D/3D with modelling tools such as Cadence Sigrity, Ansoft HFSS/Q3D, Keysight ADS
  • Knowledge of high-speed IO interfaces including DDR/GDDR/LPDDR/HBM, PCIE, 28G Ethernet, 56G/112G PAM4
  • Strong understanding of package substrate manufacturing design rules and materials
  • BS and/or MS in Electrical/Computer Engineering or Physics 
  • 4+ years relevant experience in package design and signal integrity
  • Strong communication skills and ability to interact with both internal and external customers to understand how to best address requirements in terms of their package requirements.
  • Technically creative, results oriented with the ability to manage multiple tasks
  • High degree of self-motivation and personal responsibility 
  • Team player with strong collaborative problem-solving skills

Rambus offers a competitive compensation package, which includes a strong base salary, bonus, equity, matching 401(k), employee stock purchase plan, comprehensive medical and dental benefits, time-off program and gym membership.

 

Rambus creates cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting. Our chips, customizable IP cores, architecture licenses, tools, services, training and innovations improve the competitive advantage of our customers. We collaborate with the industry, partnering with leading ASIC and SoC designers, foundries, IP developers, EDA companies and validation labs. Our products are integrated into tens of billions of devices and systems, powering and securing diverse applications, including Big Data, Internet of Things (IoT), mobile, consumer and media platforms. At Rambus, we are makers of better. For more information about Rambus, visit rambus.com. For additional information on life at Rambus and our current openings, check out rambus.com/careers/.

Apply Now

Please send me more jobs like this by email

Not You?

Thank you

People Also Viewed

Sr. Design Engineer

2020-6994 Hillsboro Oregon United States 1100 NE Compton Drive, AmberGlen, Hillsboro, Oregon, United States, 97006 Engineering
Responsibilities Design architecting and trade-off analysis RTL coding and verification Controller + PHY integration and verification FPGA targeting Customer delivery and support Qualifications Strong Verilog RTL design and verification expertise ...

Sr. Embedded Software Engineer

2020-7009 Vught Netherlands Boxtelseweg 26, Vught, Netherlands Engineering
Grade: SMTS2Location: Vught, The NetherlandsDepartment: Security division - R&DType of contract: temp to permReports to: R&D director Silicon IP From chip-to-cloud-to-crowd, Rambus secure silicon IP helps protect the world’s most valuable ...

Signal Integrity Engineer

2020-7003 San Jose California United States 4453 North First Street, Suite 100, Alviso, San Jose, California, United States, 95134 Engineering
At Rambus, we are turning incredible possibilities into everyday reality by helping to deliver the innovations that greatly impact the world we live in. We create leading-edge semiconductor and IP products, spanning memory and interfaces to securi...

Circuit Design Engineer - Digital

2020-6999 San Jose California United States 4453 North First Street, Suite 100, Alviso, San Jose, California, United States, 95134 Engineering
Dedicated to making data faster and safer, Rambus creates innovative hardware, software and services that drive technology advancements from the data center to the mobile edge. Our architecture licenses, IP cores, chips, software, and services spa...

PMIC Architect

2020-7000 San Jose California United States 4453 North First Street, Suite 100, Alviso, San Jose, California, United States, 95134 Engineering
Dedicated to making data faster and safer, Rambus creates innovative hardware, software and services that drive technology advancements from the data center to the mobile edge. Our architecture licenses, IP cores, chips, software, and services spa...

Circuit Design Engineer - Analog

2020-6998 San Jose California United States 4453 North First Street, Suite 100, Alviso, San Jose, California, United States, 95134 Engineering
Dedicated to making data faster and safer, Rambus creates innovative hardware, software and services that drive technology advancements from the data center to the mobile edge. Our architecture licenses, IP cores, chips, software, and services spa...

Job Alerts

Not You?

Thank you

Apply Now

Please send me more jobs like this by email

Not You?

Thank you