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Dedicated to making data faster and safer, Rambus creates innovative hardware, software and services that drive technology advancements from the data center to the mobile edge. Our architecture licenses, IP cores, chips, software, and services span memory and interfaces, security and emerging technologies to positively impact the modern world.
Our customers are leading chip and system design firms, foundries, and service providers. Our products are integrated into tens of billions of devices and systems. They power and secure diverse applications in a growing number of target segments including data center, networking, AI, automotive and IOT.
Rambus is seeking to hire exceptional talent to join some of the brightest inventors and engineers in the world to develop products that have real life impact.
Rambus is looking for an experienced IC package design engineer in the Systems Engineering team of IP Cores BU. The suitable candidate will be involved through the design and development phase of both high-speed complex SerDes and Memory IP PHY development as well as semiconductor product chips. You will work closely with die floor-planning and physical design teams to complete package/interposer route feasibility studies for the targeted applications considering the form-factor, cost and performance. You will be responsible for developing the die level bump-out and the package level pin-out and the overall package design, development and manufacturing. You will also be responsible for the analyzing this database and ensuring that it meets the electrical signal and power integrity requirements. You will document the design and release package design guideline.
Rambus offers a competitive compensation package, which includes a strong base salary, bonus, equity, matching 401(k), employee stock purchase plan, comprehensive medical and dental benefits, time-off program and gym membership.
Rambus creates cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting. Our chips, customizable IP cores, architecture licenses, tools, services, training and innovations improve the competitive advantage of our customers. We collaborate with the industry, partnering with leading ASIC and SoC designers, foundries, IP developers, EDA companies and validation labs. Our products are integrated into tens of billions of devices and systems, powering and securing diverse applications, including Big Data, Internet of Things (IoT), mobile, consumer and media platforms. At Rambus, we are makers of better. For more information about Rambus, visit rambus.com. For additional information on life at Rambus and our current openings, check out rambus.com/careers/.